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dc.contributor.authorChen, Kangwei
dc.date.accessioned2026-05-29T02:58:59Z
dc.date.available2026-05-29T02:58:59Z
dc.date.issued2026en_AU
dc.identifier.urihttps://hdl.handle.net/2123/35370
dc.description.abstractCopper (Cu) and its alloys are indispensable to modern society due to their exceptional electrical and thermal conductivity, mechanical performance, and corrosion resistance. The transition towards Industry 4.0 and beyond has intensified demand for advanced Cu-based materials. Additive manufacturing (AM) offers the potential to realise these requirements through design flexibility, reduced material waste, and component customisation. However, its application to Cu alloys remains hindered by challenges intrinsic to Cu, such as high reflectivity and rapid heat dissipation. AM imposes cyclic, spatially localised energy inputs that generate steep thermal and stress transients, producing microstructural phenomena not predicted by steady-state metallurgy. Consequently, the fundamental links between powder feedstock, processing conditions, microstructural evolution, post-processing and the resulting mechanical and functional properties are not yet well understood, limiting the widespread adoption of AM Cu alloys. This thesis systematically investigates how AM process parameters, alloying strategies, and powder feedstock characteristics govern the microstructure and performance of three representative Cu alloys—Cu-10Sn, Cu-1Ti, and Cu30Ni. Through a combination of advanced microscopy, mechanical and electrical testing, computational fluid dynamics simulations, thermodynamic simulations, and density functional theory calculations, this thesis establishes quantitative links between processing conditions, microstructural features, and macroscopic properties. Collectively, the findings provide new insights into the solidification pathways, microstructural evolution, and strengthening mechanisms unique to AM Cu-based alloys and deliver practical guidelines for optimising alloy and process design. By bridging fundamental metallurgy with AM-specific processing, the thesis contributes to enabling Cu alloys as next-generation functional and structural materials.en_AU
dc.language.isoenen_AU
dc.subjectAdditive manufacturingen_AU
dc.subjectCu alloyen_AU
dc.subjectMicrostructureen_AU
dc.subjectMechanical propertyen_AU
dc.subjectStrengtheningen_AU
dc.subjectConductivityen_AU
dc.titleAdvancing Additive Manufacturing of Copper Alloys: Processing, Microstructure, and Property Optimisationen_AU
dc.typeThesis
dc.type.thesisDoctor of Philosophyen_AU
dc.rights.otherThe author retains copyright of this thesis. It may only be used for the purposes of research and study. It must not be used for any other purposes and may not be transmitted or shared with others without prior permission.en
usyd.facultySeS faculties schools::Faculty of Engineeringen_AU
usyd.degreeDoctor of Philosophy Ph.D.en_AU
usyd.awardinginstThe University of Sydneyen_AU
usyd.advisorRinger, Simon
usyd.include.pubNoen_AU


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